Method of manufacturing organic el device, organic el device and electronic apparatus

ABSTRACT

A method of manufacturing an organic EL device according to the present application example includes forming a sealing layer by covering multiple organic EL elements and a connection terminal, forming a color filter as an organic layer that covers the sealing layer, patterning the color filter in such a manner that an opening extending up to the sealing layer is formed in a portion of the color filter, which overlaps the connection terminal, and etching the sealing layer in such a manner as to expose at least one part of the connection terminal with the pattern-formed color filter serving as a mask.

BACKGROUND

1. Technical Field

The present invention relates to a method of manufacturing an organic ELdevice equipped with an organic electroluminescence (EL) element, anorganic EL device, and an electronic apparatus equipped with the organicEL device.

2. Related Art

An organic EL element is configured to have an anode, a cathode, and afunctional layer including an organic light-emitting layer interposedbetween these electrodes. A functional layer emits light when energy,generated by re-combining a hole injected from the side of the anode andan electron injected from the side of the cathode in an organiclight-emitting layer, is converted into fluorescence or phosphorescence.However, when water or oxygen penetrates into the functional layerthrough the anode or the cathode from the outside, injection of acarrier (the hole or the electron) into the organic light-emitting layeris prevented. This decreases luminance of light emission or causes thefunctional layer to degenerate and to lose a function of light emission.As a result of this, a so-called dark spot occurs.

In the organic EL device equipped with such an organic EL element, asealing layer that covers the multiple organic EL elements is formed toprevent penetration of water, oxygen or others.

On the other hand, multiple connection terminals to which various wiringof the organic EL device is connected is provided in the organic ELdevice described above, in order to accomplish a connection to anexternal drive circuit. When forming the sealing layer, it is necessaryto expose the connection terminal so that the connection terminal can beelectrically used because the connection terminal is formed earlier thanthe sealing layer.

For example, in JP-A-2002-151254, a method of manufacturing an organicEL element is disclosed in which after forming a layered body thatresults from depositing an anode, an organic layer including alight-emitting layer, and a cathode, but before forming a protectivefilm equivalent to the sealing layer, a surface of an electrodeconnection portion is reformed in such a manner that the electrodeconnection portion is not covered with the protective film.

Furthermore, for example, in JP-A-2010-244696, a method of manufacturingan organic EL device is disclosed that includes forming a first gasbarrier layer, made from an inorganic material, which covers alight-emitting region including multiple organic EL element on anelement substrate, using a plasma CVD method, and forming a second gasbarrier layer in such a manner to overlap planarly with respect to thefirst gas barrier layer using an ion implanting method. In such a methodof manufacturing an organic EL device, the first gas barrier layer andthe second gas barrier layer are formed using a film formation mask thathas an opening corresponding to a light-emitting region. To put itanother way, since the connection terminal is covered with the filmformation mask, the first gas barrier layer and the second gas barrierlayer that are equivalent to the sealing layer are not formed on theconnection terminal.

In the method of manufacturing an organic EL element, disclosed inJP-A-2002-151254, it is necessary to reform the surface of the electrodeconnection portion in advance. Because of this, there occurs a problemin that the manufacturing process becomes complex.

Furthermore, in the method of manufacturing an organic EL device,disclosed in JP-A-2010-244696, when the element substrate and the filmformation mask are not set to a predetermined position, there is aconcern that an inorganic material will be attached to the connectionterminal. Therefore, the smaller is a portion on which the connectionterminal is provided, the more difficult it is to align a position ofthe element substrate with a position of the film formation mask. Inaddition, at the time of a mass production, because it is necessary toremove the inorganic material attached to the film formation mask, thiscauses a problem in that the durability of the film formation mask isrequired.

SUMMARY

The invention can be realized in forms or application examples.

APPLICATION EXAMPLE 1

According to this application example, there is provided a method ofmanufacturing an organic EL device including multiple organic ELelements that are arranged on a substrate, and a connection terminal,the method including forming a sealing layer by covering the multipleorganic EL elements and the connection terminal, forming an organiclayer that covers the sealing layer, patterning the organic layer insuch a manner that an opening extending up to the sealing layer isformed in a portion of the organic layer, which overlaps the connectionterminal, and etching the sealing layer in such a manner as to expose atleast one part of the connection terminal with the pattern-formedorganic layer serving as a mask.

In this case, the sealing layer can be formed over an entire surface ofthe substrate without using a film formation mask. Furthermore, theportion of the sealing layer, which overlaps the connection terminal, isremoved by the etching with the organic layer pattern-formed on thesealing layer serving as the mask. Therefore, since the portion of thesealing layer that overlaps the connection terminal is removed, it isunnecessary to prepare, for example, dispensing and patterning ofdedicated photo resist, and it is possible to expose the connectionterminal in an available state with a simple manufacturing process. Thatis, the method of manufacturing the organic EL device with highproductivity can be provided.

APPLICATION EXAMPLE 2

In the method of manufacturing an organic EL device according to theapplication example, the organic EL device may include a color filterincluding coloration layers representing at least red, green, and blueon the sealing layer, and the organic layer may be formed as at leastthe coloration layer representing at least one color.

In this case, the portion of the sealing layer, which overlaps theconnection terminal, can be removed by the etching with the colorationlayer representing at least one color, formed in the forming of thecoloration layers representing at least three colors, serving as a mask.

APPLICATION EXAMPLE 3

In the method of manufacturing an organic EL device according to theapplication example, the organic EL device may include a color filterincluding coloration layers representing at least red, green, and blueon the sealing layer, and the organic layer may be formed, as aninsulation layer that differentiates between the coloration layers interms of color, on the sealing layer.

In this case, the portion of the sealing layer, which overlaps theconnection terminal, can be removed by the etching with the organiclayer, as the insulation layer that differentiates between thecoloration layers in terms of color, serving as the mask. Furthermore,since the coloration layers are differentiated by the organic layer fromone another in terms of color when viewed from above, the organic ELdevice can be manufactured in which a color mixture and the like areimproved in terms of view angle characteristics when compared to thecase where the organic layer is not present.

APPLICATION EXAMPLE 4

In the method of manufacturing an organic EL device according to theapplication example, the organic EL device may include, sub-pixels thatincludes one of the multiple organic EL elements and which are providedcorresponding to at least red, green, and blue, a pixel including thecolor-different sub-pixels, and a color filter including colorationlayers representing at least red, green, and blue on the sealing layer,and the organic layer may be formed, as an insulation layer thatdifferentiates between the coloration layers in terms of color anddifferentiates between the sub-pixels, on the sealing layer.

In this case, since the organic layer functions as the insulation layerthat differentiates between the sub-pixels when viewed from above, theorganic EL device can be manufactured in which a color mixture and thelike are improved in terms of view angle characteristics when comparedto the case where the organic layer is not present.

APPLICATION EXAMPLE 5

In the method of manufacturing an organic EL device according to theapplication example, in the etching of the sealing layer, the sealinglayer may be anisotropically etched in a state where a protective memberis arranged in such a manner as to face toward the color filter.

In this case, the portion of the sealing layer, which overlaps theconnection terminal, can be removed with great precision by the etchingwithout causing damage to the color filter due to the anisotropicetching.

APPLICATION EXAMPLE 6

The method of manufacturing an organic EL device according to theapplication example, may further include arranging an opposite substratewith respect to the color filter with a transparent resin layer inbetween, in which in the etching of the sealing layer, the sealing layermay be etched with the opposite substrate in between.

In this case, the portion of the sealing layer, which overlaps theconnection terminal, can be removed by the etching using the oppositesubstrate that protects the color filter, without causing damage to thecolor filter due to the etching.

APPLICATION EXAMPLE 7

In the method of manufacturing an organic EL device according to theapplication example, the organic EL device may include a color filterincluding coloration layers representing at least red, green, and blueon the sealing layer, and the organic layer may be an overcoat layerthat covers the color filter.

In this case, the portion of the sealing layer, which overlaps theconnection terminal, can be removed by the etching with the overcoatlayer covering the color filter serving as the mask.

APPLICATION EXAMPLE 8

In the method of manufacturing an organic EL device according to theapplication example, in the patterning of the organic layer, the openingportion may be formed in such a manner as to be opened over the multipleconnection terminals.

In this case, the opening portion can be formed without needing greatposition precision. Furthermore, an arrangement pitch of the multipleconnection terminals is small, and the multiple connection terminals canbe easy to expose.

APPLICATION EXAMPLE 9

According to this application example, there is provided an organic ELdevice including multiple organic EL elements that are arranged on asubstrate, a connection terminal, a sealing layer that covers themultiple organic EL elements and the multiple connection terminals, anorganic layer that covers the sealing layer, and an opening portion thatpierces through the organic layer and the sealing layer and exposes atleast one part of the connection terminal.

In this case, the organic EL device can be provided that has highconnection reliability without being influenced by the sealing layer orthe organic layer.

APPLICATION EXAMPLE 10

The organic EL device according to the application example may furtherinclude a color filter, provided on the sealing layer, which includescoloration layers representing at least red, green, and blue, and whichare arranged corresponding to the multiple organic EL elements, in whichof the color filter, the organic layer is at least the coloration layerrepresenting at least one color.

In this case, the organic EL device can be provided that has highconnection reliability and excellent display quality by using thecoloration layer representing at least one color without providing anyspecial configuration as an organic layer.

APPLICATION EXAMPLE 11

The organic EL device according to the application example may furtherinclude a color filter, provided on the sealing layer, which includescoloration layers representing at least red, green, and blue, and whichare arranged corresponding to the multiple organic EL elements, in whichthe organic layer may be an insulation layer that differentiates betweenthe coloration layers in terms of color.

In this case, the organic EL device can be provided in which the colormixture and the like are improved in terms of view angle characteristicsin addition to the high connection reliability.

APPLICATION EXAMPLE 12

The organic EL device according to the application example, may furtherinclude a color filter, provided on the sealing layer, which includescoloration layers representing at least red, green, and blue, and whichare arranged corresponding to the multiple organic EL elements, in whichthe organic layer may be an overcoat layer that covers the color filter.

In this case, the organic EL device can be provided that has excellentdurability quality in addition to the high connection reliability.

APPLICATION EXAMPLE 13

In the organic EL device according to the application example, theopening portion may be provided for every multiple connection terminals.

In this case, insulation between the connection terminals can beincreased.

APPLICATION EXAMPLE 14

In the organic EL device according to the application example, theopening portion may be provided in such a manner that the multipleconnection terminals are exposed within the opening portion.

In this case, formation precision demanded by the opening portion can bedecreased.

APPLICATION EXAMPLE 15

According to this application example, there is provided an electronicapparatus including the organic EL device formed using the method ofmanufacturing an organic EL device according to the application examplesdescribed above.

In this case, the electronic apparatus can be provided in which highconnection reliability and cost performance are realized.

APPLICATION EXAMPLE 16

According to this application example, there is provided an electronicapparatus including the organic EL device according to the applicationexamples described above.

In this case, the electronic apparatus can be provided in which highconnection reliability is realized.

BRIEF DESCRIPTION OF THE DRAWINGS

The invention will be described with reference to the accompanyingdrawings, wherein like numbers reference like elements.

FIG. 1 is an equivalent circuit diagram illustrating an electricalconfiguration of an organic EL device according to a first embodiment.

FIG. 2 is a schematic plan diagram illustrating a configuration of theorganic EL device according to the first embodiment.

FIG. 3 is a schematic plan diagram illustrating an arrangement of pixelsaccording to the first embodiment.

FIG. 4 is a schematic cross-sectional diagram illustrating aconstruction of the organic EL device, taken along a line IV-IV in FIG.3.

FIG. 5 is a schematic cross-sectional diagram illustrating theconstruction of the organic EL device, taken along a line V-V in FIG. 2.

FIG. 6 is a flowchart illustrating a method of manufacturing the organicEL device according to the first embodiment.

FIGS. 7A to 7D are schematic cross-sectional diagrams illustrating themethod of manufacturing the organic EL device according to the firstembodiment.

FIGS. 8A and 8B are schematic cross-sectional diagrams illustrating themethod of manufacturing the organic EL device according to the firstembodiment.

FIG. 9 is a schematic plan diagram illustrating a relationship between aconnection terminal and an opening portion in a terminal portion.

FIG. 10A is a schematic cross-sectional diagram illustrating a mothersubstrate to which multiple element substrates are surface-attached, andFIG. 10B is an enlarged schematic plan diagram illustrating the elementsubstrate in a surface-attached state.

FIGS. 11A and 11B are schematic cross-sectional diagrams illustrating aconstruction of the terminal portion after the mother substrate isscribed.

FIGS. 12A and 12B are schematic cross-sectional diagrams illustrating amethod of manufacturing an organic EL device according to a secondembodiment.

FIG. 13 is a schematic cross-sectional diagram illustrating aconfiguration of a pixel of an organic EL device according to a thirdembodiment.

FIG. 14 is a schematic cross-sectional diagram illustrating theconstruction of the pixel of the organic EL device according to thethird embodiment, taken along a line XIV-XIV in FIG. 13.

FIG. 15 is a schematic cross-sectional diagram illustrating aconstruction of the periphery of a terminal portion of the organic ELdevice according to the third embodiment.

FIG. 16 is a schematic cross-sectional diagram illustrating aconstruction of a pixel of an organic EL device according to a fourthembodiment.

FIG. 17 is a schematic cross-sectional diagram illustrating aconstruction of the periphery of a terminal portion of the organic ELdevice according to the fourth embodiment.

FIG. 18 is a schematic diagram illustrating a head-mountable display asan electronic apparatus.

FIG. 19 is a schematic plan diagram illustrating an arrangement of anopening portion and a connection terminal according to a modificationexample.

FIGS. 20A to 20C are shematic diagrams, FIG. 20A is a schematic plandiagrams illustrating an insulation layer according to the modificationexample, FIG. 20B is a schematic cross-sectional diagram taken along aline XXB-XXB in FIG. 20A, and FIG. 20C is a schematic cross-sectionaldiagram taken along a line XXC-XXC in FIG. 20A.

DESCRIPTION OF EXEMPLARY EMBODIMENTS

Embodiments according to the invention are described below referring tothe drawings. Moreover, the drawings referred to here illustratedescribed portions in such a manner that the portions are suitablyenlarged or reduced to make them recognizable.

In addition, according to the embodiments that follow, for example, acase where the expression “on the substrate” is provided is defined tomean that a given component is arranged on the substrate in such amanner as to come into contact with the substrate, or that the givencomponent is arranged on the substrate with another component inbetween, or that one part of the given component is arranged on thesubstrate in such a manner as to come into contact with the substrate,or that one part of the given component is arranged on the substratewith another component in between.

First Embodiment

Organic EL Device

First, an organic electroluminescence (EL) device according to thepresent embodiment is described referring to FIGS. 1 to 3. FIG. 1 is anequivalent circuit diagram illustrating an electrical configuration ofthe organic EL device according to the first embodiment. FIG. 2 is aschematic plan diagram illustrating a configuration of the organic ELdevice according to the first embodiment. FIG. 3 is a schematic plandiagram illustrating an arrangement of pixels according to the firstembodiment.

As illustrated in FIG. 1, the organic EL device 100 according to thepresent embodiment has multiple scan lines 12 and multiple data lines 13that intersect one another and multiple power lines 14 that are arrangedin parallel with the multiple data lines 13, respectively. The organicEL device 100 has a scan line drive circuit 16 to which the multiplescan lines 12 are connected and a data line drive circuit 15 to whichthe multiple data lines 13 are connected. Furthermore, the organic ELdevice 100 has multiple sub-pixels 18 that are arranged in the form of amatrix in such a manner they correspond to portions at which themultiple data lines 13 and the multiple scan lines 12 intersect oneanother, respectively.

The sub-pixel 18 has an organic EL element 30, a light emitting elementand a pixel circuit 20 that controls drive of the organic EL element 30.

The organic EL element 30 has a pixel electrode 31, which functions asan anode, an opposite electrode 33, which functions as a cathode, and afunctional layer 32, which includes an organic light-emitting layerprovided between the pixel electrode 31 and the opposite electrode 33.Such an organic EL element 30 can expressed as a diode in terms ofelectricity.

The pixel circuit 20 includes a switching transistor 21, a capacitor 22,and a drive transistor 23. The two transistors 21 and 23, for example,can be configured from n-channel or p-channel thin film transistors(TFT) or MOS transistors.

A gate of the switching transistor 21 is connected to the scan line 12,one of a source and a drain is connected to the data line 13, and theother of the source and the drain is a gate of the drive transistor 23.

One of a source or a drain of the drive transistor 23 is connected tothe pixel electrode 31 of the organic EL element 30, and the other ofthe source or the drain is connected to the power line 14.

The capacitor 22 is connected between a gate of the drive transistor 23and the power line 14.

When the scan line 12 is driven and thus the switching transistor 21 isturned on, an electric potential is retained in the capacitor 22 throughthe switching transistor 21, based on an image signal supplied from thedata line 13. It is determined whether the drive transistor 23 is turnedon or turned off, depending on an electric potential of the capacitor22, that is, a gate electric potential of the drive transistor 23. Then,when the drive transistor 23 is turned on, an amount of electric currentaccording to the gate electric potential flows from the power line 14 tothe functional layer 32 that is interposed between the pixel electrode31 and the opposite electrode 33 through the drive transistor 23. Theorganic EL element 30 emits light, according to the amount of electriccurrent that flows through the functional layer 32.

In addition, the pixel circuit 20 is not limited to this configuration.For example, the pixel circuit 20 may include a light emission controltransistor that is provided between the pixel electrode 31 and the drivetransistor 23 to control electric conduction between the pixel electrode31 and the drive transistor 23.

As illustrated in FIG. 2, the organic EL device 100 has an elementsubstrate 10 and an opposite substrate 41 that is arranged in such amanner as to face toward the element substrate 10. A display region E1(which is indicated by dashed lines in the drawing) and a dummy regionE2 (which is indicated by two-dot chain lines in the drawing) outside ofthe display region E1 are provided on the element substrate 10. Anon-display region is outside of the dummy region E2.

The sub-pixels 18 are arranged in the form of a matrix on the displayregion E1. The sub-pixel 18, as described above, includes the organic ELelement 30, the light emitting element. The sub-pixel 18 is configuredin such a manner that emission of any of red (R) light, green (G) light,and blue (B) light can be obtained according to operations of theswitching transistor 21 and the drive transistor 23.

According to the present embodiment, the sub-pixels 18 are arranged insuch a so-called strip type that the sub-pixels 18 in each of whichemission of light with the same color can be obtained are arranged in afirst direction, and the sub-pixels 18 in each of which emission ofcolor-different light can be obtained are arranged in a second directionintersecting (perpendicular to) the first direction. Descriptions areprovided below with the first direction as a Y direction and the seconddirection as an X direction. In addition, in the element substrate 10,the arrangement of the sub-pixels 18 is not limited to the stripe type,but may be made by employing a mosaic type or a delta type.

A peripheral circuit, which is for mainly causing the organic EL element30 of each sub-pixel 18 to emit light, is provided on the dummy regionE2. For example, as illustrated in FIG. 2, a pair of scan line drivecircuits 16 is provided in such a manner as to extend in the Ydirection. The display region E1 is interposed between the pair of scanline drive circuits in the X direction. An inspection circuit 17 isprovided along the display region E1 between the pair of scan line drivecircuits 16.

A wiring layer 29 is arranged on the element substrate 10 in such amanner that the wiring layer 29 extends in the Y direction along thepair of scan line drive circuit 16 and in the X direction along theinspection circuit 17 and thus surrounds the dummy region E2. Theorganic EL element 30 of the opposite electrode 33 is formed as a commoncathode over the multiple organic EL elements 30, that is, thesub-pixels 18. Furthermore, the opposite electrode 33 is formed in sucha manner as to start from the display region E1 and reach thenon-display region and thus is electrically connected to the wiringlayer 29 in the non-display region.

The element substrate 10 is greater in size than the opposite substrate41. Thus, the multiple connection terminals 101 for establishingelectric connection to an external drive circuit are arranged in the Xdirection, on one peripheral portion that protrudes when viewed in the Ydirection from the opposite substrate 41 (which is a peripheral portionbetween an end portion of the substrate 10 and the dummy region E2 inthe lower portion of the drawing and is hereinafter referred to as aterminal portion 11 t). A flexible circuit substrate (FPC) 105 isconnected to the multiple connection terminals 101. A drive IC 110 isbuilt into the FPC 105. The drive IC 110 includes the data line drivecircuit 15 described above. The FPC 105 has an input terminal 102 thatis connected to an input side of the drive IC 110 through wiring and anoutput terminal (its illustration is omitted) that is connected to anoutput side of the drive IC 110 through the wiring. The data line 13 andthe power line 14 on the element substrate 10 are electrically connectedto the drive IC 110 through the connection terminal 101 and the FPC 105.The wiring that is connected to the scan line drive circuit 16 and theinspection circuit 17 is electrically connected to the drive IC 110through the connection terminal 101 and the FPC 105. Furthermore, theopposite electrode 33 as the common cathode is also electrically to thedrive IC 110 through the wiring layer 29 and the connection terminal101, and the FPC 105. Therefore, a control signal, a drive electricpotential (VDD), and the like are supplied from the drive IC 110 to anyone of the multiple connection terminals 101 that are arranged on theterminal portion 11 t. A well-known method can be used as a method tomake electrical connection between the multiple connection terminals 101on the element substrate 10 and the output terminal on the FPC 105.Examples include a method to use a thermoplastic anisotropic conductivefilm and a method to use a thermal curing anisotropic adhesive.

Next, a configuration and a plane arrangement of the sub-pixels 18 aredescribed referring to FIG. 3. The organic EL device 100 according tothe present embodiment is configured from a combination of the organicEL element 30 in which emission of white light can be obtained and acolor filter 36 including red (R), green (G), and blue (B) colorationlayers.

As illustrated in FIG. 3, the sub-pixel 18R in which emission of red (R)light can be obtained, the sub-pixel 18G in which emission of green (G)light can be obtained, and the sub-pixel 18B in which emission of blue(B) light can be obtained are arranged in the X direction. Thesub-pixels 18 in each of which emission of light with the same color canbe obtained are arranged in the Y direction. The configuration isprovided in which the three sub-pixels 18R, 18G, and 18B arranged in theX direction are represented as one pixel 19.

According to the present embodiment, an arrangement pitch of thesub-pixels 18R, 18G, and 18B in the X direction is less than 5 μm. Thesub-pixels 18R, 18G, and 18B are arranged by a space of 0.5 μm to 1.0 μmin the X direction. The arrangement pitch of the sub-pixel 18R, 18G, and18B in the Y direction is less than approximately 10 μm.

The pixel electrode 31 in the sub-pixel 18 is in a substantiallyrectangular shape and the longitudinal direction of the pixel electrode31 is in parallel with the Y direction. The pixel electrode 31 isreferred to as the pixel electrodes 31R, 31G, and 31B to providecorrespondence with light emission colors. A film is formed to cover anedge of each of the pixel electrodes 31R, 31G, and 31B and then apartition wall 28 is formed by processing the film. By doing this, anopening portion 28 a is formed on each of the pixel electrodes 31R, 31G,and 31B, and within the opening portion 28 a provided in the partitionwall 28, each of the pixel electrodes 31R, 31G, and 31B is in contactwith the functional layer 32. Furthermore, a plane shape of the openingportion 28 a is also substantially rectangular. In addition, thesubstantially rectangular shape includes a rectangular shape, arectangular shape of which corners are round, a rectangular shape ofwhich short sides are curved, and the like.

The red (R) coloration layer 36R of the color filter 36 is formed insuch a manner as to overlap the multiple pixel electrodes 31R that arearranged in the Y direction. The green (G) coloration layer 36G isformed in such a manner as to overlap the multiple pixel electrodes 31Gthat are arranged in the Y direction. The blue (B) coloration layer 36Bis formed in such a manner as to overlap the multiple pixel electrodes31B that are arranged in the Y direction. To put it another way, thecolor-different color coloration layers 36R, 36G, and 36B are extendedin the Y direction and thus are formed in the form of a stripe andfurther are formed in such a manner as to come into contact with oneanother in the X direction.

Next, a construction of the organic EL device 100 is described referringFIGS. 4 and 5. FIG. 4 is a schematic cross-sectional diagramillustrating the construction of the organic EL device, taken along aline IV-IV in FIG. 3. FIG. 5 is a schematic cross-sectional diagramillustrating the construction of the organic EL device, taken along aline V-V in FIG. 2. FIG. 4 illustrates a construction of the sub-pixel18 in the display region E1. FIG. 5 illustrates a construction of theterminal portion 11 t.

As illustrated in FIG. 4, the organic EL device 100 includes an elementsubstrate 10 including a base substrate 11, and the pixel circuit 20,the organic EL element 30, a sealing layer 34 sealing the multipleorganic EL element 30, and the color filter 36, all of which are formedin this sequence on the base substrate 11. Furthermore, the organic ELdevice 100 includes the opposite substrate 41 that faces toward theelement substrate 10.

The opposite substrate 41, for example, is made from a transparentsubstrate such as glass, and is arranged in such a manner as to facetoward the element substrate 10 with a transparent resin layer 42 inbetween in order to protect the color filter 36 formed on the sealinglayer 34.

The light emitted from the functional layer 32 of the sub-pixels 18R,18G, and 18B is reflected from a reflection layer 25 described below andpasses through the color filter 36, resulting in being projected fromthe opposite substrate 41. That is, the organic EL device 100 is a topemission type light emitting apparatus.

As the base substrate 11, a transparent substrate such as glass anopaque substrate such as silicon or ceramic can be used because theorganic EL device 100 is a top emission type. A case where a thin filmtransistor is used in the pixel circuit 20 is described below.

A film is formed to cover a surface of the base substrate 11 and then afirst insulation film 11 a is formed by processing the film. In thepixel circuit 20, for example, a semiconductor layer 23 a of the drivetransistor 23 is formed on the first insulation film 11 a. A film isformed to cover the semiconductor layer 23 a, and then a secondinsulation film 11 b, which functions as a gate insulation film, isformed by processing the film. A gate electrode 23 g is formed in aposition that faces toward a channel region of the semiconductor layer23 a with the second insulation film 11 b in between. A film is formedto cover the gate electrode 23 g and then thus a first interlayerinsulation film 24 is formed by processing the film to a film thicknessranging from 300 nm to 2 μm. Flattening processing is performed on thefirst interlayer insulation film 24 in order to remove surfaceirregularity that occurs by covering, for example, the drive transistor23 of the pixel circuit 20. Contact holes, which pierce through thesecond insulation film 11 b and the first interlayer insulation film 24,are formed to correspond to a source region 23 s and a drain region 23 dof the semiconductor layer 23 a, respectively. A conductive film isformed in such a manner as to fill the contact holes and is patterned,and thus an electrode and wiring that are connected to the drivetransistor 23 are formed. Furthermore, the conductive film is formedwith a reflective metal such as aluminum, or alloy of aluminum and Ag(silver) or Cu (copper), and the reflection layer 25, independent of thesub-pixel 18, is formed by patterning the formed conductive film.Although their illustration is omitted in FIG. 4, in the pixel circuit20, the switching transistor 21 and the capacitor 22 are also formed onthe base substrate 11.

A film is formed to cover the reflection layer 25 and the firstinterlayer insulation film 24 and then a second interlayer insulationfilm 26 is formed by processing the film to a film thickness rangingfrom 10 nm to 2 μm. Furthermore, the contact holes for establishingelectrical connection between the pixel electrode 31 and the drivetransistor 23 are formed later by piercing through the second interlayerinsulation film 26. For example, silicon oxide, silicon nitride, orsilicon oxynitride can be used as a material that makes up the firstinsulation film 11 a, the second insulation film 11 b, the firstinterlayer insulation film 24, and the second interlayer insulation film26.

A film is formed to cover the second interlayer insulation film 26 andthen a conductive film is film-formed by processing the film in such amanner as to fill the contact holes formed on the second interlayerinsulation film 26. Then, the pixel electrodes 31 (31R, 31G, and 31B) isformed by patterning the conductive film. The pixel electrode 31 (31R,31R, and 31B) is formed with a transparent conductive film such asindium tin oxide (ITO). In addition, if the reflection layer 25 is notprovided in the sub-pixel 18, the pixel electrode 31 (31R, 31G, and 31B)may be formed with a metal with light reflection such as aluminum oraluminum alloy.

A film is formed to cover an edge portion of each of the pixelelectrodes 31R, 31G, and 31B, and then partition wall 28 is formed byprocessing the film. By doing this, the opening portion 28 a is formedin the pixel electrodes 31R, 31G, and 31B. The partition wall 28 isformed with acrylic-based photo-resistive resin in such a manner thatthe pixel electrodes 31R, 31G, and 31B result from the partitioning at aheight of approximately 1 μm.

In addition, according to the present embodiment, the partition wall 28,made from the photo-resistive resin, is formed to make the pixelelectrodes 31R, 31G, and 31B insulated from one another, but the pixelelectrodes 31R, 31G, and 31B may result from the partitioning throughthe use of an inorganic insulation material such as silicon oxide.

The functional layer 32 is formed by using a vapor phase process such asa vacuum deposition method or an ion implantation method in such amanner to come into contact with the pixel electrodes 31R, 31G, and 31B,a surface of the partition wall 28 also is covered with the functionallayer 32. In addition, the functional layer 32 is not necessary to coveran entire surface of the partition wall 28, and because if thefunctional layer 32 is formed on the region partitioned by the partitionwall 28, this is sufficient, a top portion of the partition wall 28 isnot necessary to be covered with the functional layer 32.

The functional layer 32, for example, includes a hole injection layer, ahole transport layer, an organic light-emitting layer, and an electrontransport layer. According to the present embodiment, the hole injectionlayer, the hole transport layer, the organic light-emitting layer, andthe electron transport layer are film-formed with respect to the pixelelectrode 31 and deposited in this sequence, using the vapor phaseprocess, thereby forming the functional layer 32. In addition, thefunctional layer 32 is not limited to this configuration, but mayinclude an intermediate layer that controls movement of electrons thatare carriers.

The organic light-emitting layer may have a configuration in whichemission of white light can be obtained and, for example, can employ aconfiguration in which the organic light-emitting layer in whichemission of red light can be obtained, the organic light-emitting layerin which emission of green light can be obtained, and the organiclight-emitting layer in which emission of blue light can be obtained arecombined.

A film is formed to cover the functional layer 32, and the oppositeelectrode 33 is formed as the common cathode by processing the film. Forexample, an alloy of Mg and Ag is film-formed to such an extent of filmthickness (for example 10 nm to 30 nm) that light transmittance andlight reflection can be obtained, and the opposite electrode 33 isformed by processing the formed film. By doing this, the multipleorganic EL elements 30 are completed.

By forming the opposite electrode 33 into a state where it has lighttransmittance and light reflection, an optical resonator may beconfigured from the reflection layer 25 and the opposite electrode 33for every sub-pixels 18R, 18G, and 18B. The optical resonator causeslight with a specific resonant wavelength to be projected, by causing anoptical distance between the reflection layer 25 and the oppositeelectrode 33 to differ for every sub-pixels 18R, 18G, and 18B. By doingthis, color purity of light emitted from each of the sub-pixels 18R,18G, and 18B can be increased. The optical distance is obtained as a sumof products of reflective indexes and film thicknesses of variousfunctional films that are interposed between the reflection layer 25 andthe opposite electrode 33 that makes up the optical resonator.Therefore, as a method for causing the optical distance for everysub-pixels 18R, 18G, and 18B, there are a way of causing filmthicknesses of the pixel electrodes 31R, 31G, and 31B to differ and away of causing a film thickness of the second interlayer insulation film26 between the reflection layer 25 and the pixel electrodes 31R, 31G,and 31B.

Next, the sealing layer 34, which covers the multiple organic ELelements 30, is formed in such a manner as to prevent water or oxygenfrom penetrating. The sealing layer 34 according to the presentembodiment results from depositing a first sealing layer 34 a, a bufferlayer 34 b, and a second sealing layer 34 c in this sequence, startingfrom the side of the opposite electrodes 33.

For example, an inorganic material with light transmittance andexcellent gas barrier property, such as silicon oxynitride (SiON), maybe used for formation of the first sealing layer 34 a and the secondsealing layer 34 c.

A vacuum deposition method and a sputter method can be enumerated asexamples of a method of forming the first sealing layer 34 a and thesecond sealing layer 34 c. The excellent gas barrier property can berealized by increasing the film thicknesses of the first sealing layer34 a and the second sealing layer 34 c, but a crack is easy to occur inone of them. Therefore, the film thickness may be controlled toapproximately 200 nm to 400 nm. According to the present embodiment, theexcellent gas barrier property is realized by superimposing one of thefirst sealing layer 34 a the second sealing layer 34 c on the other withthe buffer layer 34 b interposed in between.

The buffer layer 34 b can be formed, for example, with epoxy-based resinor a dispensing-type inorganic material (silicon oxide) that isexcellent in thermal stability. Furthermore, if the buffer layer 34 b isdispense-formed using a printing method such as a screen or afixed-amount discharge method, a surface of the buffer layer 34 b can beflattened. To put it another way, the buffer layer 34 b can function asa flattening layer that alleviates surface irregularity of the firstsealing layer 34 a. The buffer layer 34 b is 1 μm to 5 μm in thickness.

The coloration layers 36R, 36G, and 36B, which correspond to thesub-pixels 18R, 18G, and 18B corresponding to red, green, and blue,respectively, are formed on the sealing layer 34. As an example of amethod of forming the color filter 36 including the coloration layers36R, 36G, and 36B, a method is enumerated in which a photo-sensitiveresin layer is formed by dispensing a photo-sensitive material includinga coloring material and the formed photo-sensitive resin layer isexposed and developed using a photo lithography technique. The filmthicknesses of the coloration layer 36R, 36G, and 36B may be the sameand may be different such that at least one color is distinguishablefrom the others.

The element substrate 10 and the opposite substrate 41 are arranged witha space in between in such a manner to face toward each other, and thetransparent resin layer 42 results from filling the space with atransparent resin material. Urethane-based, acrylic-based, epoxy-based,and polyolefin-based resin materials can be enumerated as examples ofthe transparent resin material. The transparent resin layer 42 is 10 μmto 100 μm in thickness.

Next, constructions of the terminal portion 11 t of the elementsubstrate 10 and of a periphery of the terminal portion 11 t aredescribed referring to FIG. 5. As illustrated in FIG. 5, in the terminalportion 11 t of the element substrate 10, the connection terminal 101 isformed on the second interlayer insulation film 26, in the same manneras the pixel electrode 31. Furthermore, the connection terminal 101 isconnected to wiring layer 103 formed on the first interlayer insulationfilm 24, with the conductive film within the contact hole 26 a formed onthe second interlayer insulation film 26 in between. In FIG. 5,illustrations of a configuration of the pixel circuit 20 and signalwiring connected to the pixel circuit 20 on the base substrate 11, andof a configuration of a peripheral circuit such as the scan line drivecircuit 16, are omitted, but each of the multiple connection terminals101 is electrically connected to the circuits and the signal wiringthrough the wiring layer 103.

The wiring layer 103 may be patterned using the conductive film formedon the first interlayer insulation film 24, along with the reflectionlayer 25, but may be formed with a material different from a materialmaking up the reflection layer 25.

The connection terminal 101 may be patterned using the conductive filmformed on the second interlayer insulation film 26, along with the pixelelectrode 31, but may be formed with a material different from amaterial making up the pixel electrode 31.

The first sealing layer 34 a, the second sealing layer 34 c, thecoloration layer 36G, the coloration layer 36B, and the coloration layer36R are deposition-formed in this sequence on the terminal portion 11 tof the element substrate 10, and an opening portion 45, which piercesthrough such layers, is formed on the connection terminal 101. Suchlayers are not formed on at least one part of the connection terminal101, and the connection terminal 101 is exposed within the openingportion 45.

In other words, the first sealing layer 34 a and the second sealinglayer 34 c, which are made from the inorganic material, of the sealinglayer 34, are formed in such a manner as to cover not only the multipleorganic EL elements 30 (refer to FIG. 2) but also the terminal portion11 t. With regard to the color filter 36, the coloration layers 36R,36G, and 36B are formed corresponding to the sub-pixels 18R, 18G, and18B, respectively, in the following sequence: green (G), blue (B), red(R), and any one of the coloration layers 36R, 36G, and 36B are formedin such a manner to cover not only the display region E1 but also theterminal portion 11 t. Then, the opening portion 45 is formed in such amanner as to pierce through the first sealing layer 34 a, the secondsealing layer 34 c, the coloration layer 36G, the coloration layer 36B,and the coloration layer 36R. To put it another way, one examplecorresponding to an organic layer according to the invention is thecolor filter 36.

The three coloration layers 36R, 36G, and 36B are formed in such amanner they extend to over the partition wall 28 positioned in borderportions of the dummy region E2 (refer to FIG. 2) and the display regionE1, starting from an edge of the terminal portion 11 t, which facestoward the outside boundary of the element substrate 10. The colorationlayers 36R, 36G, and 36B are protected by the opposite substrate 41 withthe transparent resin layer 42 in between.

By defining the construction of the terminal portion 11 t and theperiphery thereof in this manner, the connection terminal 101 is exposedwithin the opening portion 45 and thus can be electrically connected tothe FPC 105. Furthermore, on the side of the element substrate 10, whenthe color filter 36 is formed only within the display region E1,wettability with respect to the transparent resin material making up thetransparent resin layer 42 changes due to a portion in which the colorfilter 36 is formed and a portion in which the color filter 36 is notformed. In such a case, there is a concern that a defect will occur inthat when the element substrate 10 and the opposite substrate 41 arearranged in such a manner as to face toward each other with thetransparent resin layer 42 in between, dispense irregularity of thetransparent resin material occurs and thus the transparent resinmaterial excessively protrudes from the opposite substrate 41, or a gapoccurs between the element substrate 10 and the opposite substrate 41.According to the present embodiment, the color filter 36 is successivelyformed from the display region E1 to an edge of the terminal portion 11t. Then, an area where the color filter 36 is arranged is more increasedthan an area where the color filter 36 and the transparent resin layer42 comes into contact with each other. In other words, the defectdescribed above is difficult to occur because an end portion of thecolor filter 36 is made to be positioned between an end portion of thetransparent resin layer 42 and an edge of the base substrate 11.

If the transparent resin material does not protrude excessively from theopposite substrate 41, because a dimensional tolerance for theprotrusion of the transparent resin material is unnecessary to take intoconsideration in designing the terminal portion 11 t, it is possible toprovide or manufacture the organic EL device 100 that is made small insize without changing a size of the display region E1.

Method of Manufacturing the Organic EL Device

Next, with regard to a method of manufacturing the organic EL deviceaccording the present embodiment, a method of forming the openingportion 45 that exposes the connection terminal 101 that is acharacterizing portion according to the invention is described in detailreferring to FIGS. 6 to 9. FIG. 6 is a flowchart illustrating the methodof manufacturing the organic EL device. FIGS. 7A to 7D and FIGS. 8A and8B are schematic cross-sectional diagrams illustrating the method ofmanufacturing the organic EL device. FIG. 9 is a schematic plan diagramillustrating a relationship between the connection terminal and theopening portion in the terminal portion. In addition, FIGS. 7A to 7D andFIGS. 8A and 8B are cross-sectional diagrams corresponding to FIG. 5.

As illustrated in FIG. 6, the method of manufacturing the organic ELdevice 100 according to the present embodiment includes forming thesealing layer (Step S1), forming the color filter (Step S2), etching thesealing layer (Step S3), and attaching the substrates (Step S4).

In addition, a well-known method can be employed as a method of formingthe pixel circuit 20, the peripheral circuit, the signal wiring, thereflection layer 25, the organic EL element 30 and the like on the basesubstrate 11.

In the forming of the sealing layer (Step S1) in FIG. 6, as illustratedin FIG. 7A, first, the first sealing layer 34 a is formed that coversthe opposite electrode 33 and the terminal portion 11 t. A method ofdepositing silicon oxynitride (SiON) in a vacuum is enumerated as anexample of a method of forming the first sealing layer 34 a. The firstsealing layer 34 a is approximately 200 nm to 400 nm in thickness. Next,the buffer layer 34 b is formed that covers the first sealing layer 34a. In a method of forming the buffer layer 34 b, for example, a solutionincluding epoxy resin having transparency and epoxy resin solvent isused and is dispensed and dried using the printing method or thefixed-amount discharge method, thereby forming the buffer layer 34 bmade from the epoxy resin. The buffer layer 34 b may be 1 μm to 5 μm inthickness and in this case is defined as 3 μm in thickness.

In addition, the formation of the buffer layer 34 b is not limited tothe use of an organic material such as epoxy resin. As described above,the silicon oxide film, as the buffer layer 34 b, approximately 3 μm inthickness, may be formed by dispensing the dispensing-type inorganicmaterial using the printing method and drying and firing the dispensedinorganic material.

Subsequently, the second sealing layer 34 c is formed that covers thebuffer layer 34 b. The method of depositing silicon oxynitride (SiON) ina vacuum is enumerated as an example of a method of forming the secondsealing layer 34 c, which is the same as the method of forming the firstsealing layer 34 a. The second sealing layer 34 c is approximately 200nm to 400 nm in thickness. Then, proceeding to Step S2 takes place.

In the forming of the color filter in FIG. 6 (Step S2), as illustratedin FIG. 7B, first, photo-sensitive resin layer including a coloringmaterial for green is dispensed using a spin-coating method and isdried, thereby forming the photo-sensitive resin layer. Thus, thecoloration layer 36G for green (G) is formed by exposing and developingthe photo-sensitive resin layer. The photo-sensitive resin layer coversthe terminal portion 11 t and then is formed. The patterning (exposureand development) is performed on the photo-sensitive resin layer to formthe coloration layer 36G, and at the same time, the coloration layer 36Gis patterned (exposed and developed) in such a manner that an opening isformed in a portion that overlaps the connection terminal 101 in theterminal portion 11 t.

Subsequently, as illustrated in FIG. 7C, the coloration layer 36B forblue (B) is formed. The coloration layer 36B is formed in the samemanner as the coloration layer 36G and is patterned (exposed anddeveloped) in the opening is formed in a portion that overlaps theconnection terminal 101 in the terminal portion 11 t. Furthermore, inthe cross-section of the base substrate 11 that includes the terminalportion 11 t and one part of the display region E1, an end portion ofthe coloration layer 36B (the end portion facing toward the side of thedisplay region E1), which is opposite to the side of the terminalportion 11 t, is patterned (exposed and developed) in such a manner asto overlap the partition wall 28 that is positioned in the borderportions of the display region E1 and the dummy region E2.

Then, as illustrated in FIG. 7D, the coloration layer 36R for red (R) isformed. The coloration layer 36R is formed in the same manner as thecoloration 36B and has the opening in the portion that overlaps theconnection terminal 101 in the terminal portion 11 t, and an end portionof the coloration layer 36R (the end portion facing toward the side ofthe display region E1), which is opposite to the side of the terminalportion 11 t, is patterned (exposed and developed) in such a manner asto overlap the partition wall 28 that is positioned in the borderportions of the display region E1 and the dummy region E2. Thus, theopening portion 45, obtained as a result of patterning the colorationlayers 36R, 36G, and 36B, is formed on portions of the first sealinglayer 34 a and the second sealing layer 34 c that cover the connectionterminal 101.

The opening portion 45, as illustrated in FIG. 9, is formed in such amanner that the multiple connection terminals 101 arranged on theterminal portion 11 t are included within the opening portion 45. Then,proceeding to Step S3 takes place.

In etching the sealing layer (Step S3) in FIG. 6, as illustrated in FIG.8A, the connection terminal 101 is exposed by etching the first sealinglayer 34 a and the second sealing layer 34 c within the opening portion45 with the coloration layers 36R, 36G, and 36B (the color filter 36)having the opening portion 45 serving as a mask. Dry etching in whichfluorine-based process gas such as CHF₃ (methane trifluoride) or CF₄(carbon tetrafluoride) is used is enumerated as a method in which thefirst sealing layer 34 a and the second sealing layer 34 c, made fromthe inorganic film such as silicon oxynitride (SiON), are selectivelyetched within the opening portion 45. The three coloration layers 36R,36G, and 36B overlap. In the terminal portion 11 t, but each of threecoloration layers 36R, 36G, and 36B is a single layer in the displayregion E1. Therefore, it is preferable that the dry etching be performedwith a metal mask 51 being arranged as a protective member in such amanner as to overlap the display region E1. Thus, the coloration layers36R, 36G, and 36B on the display region E1 can be prevented from beingdamaged due to the dry etching.

In addition, if CHF₃ is used as fluorine-based process gas, because aselection ratio between the SiON film and the color filter 36 in the dryetching is favorable compared to CH₄, this can make the metal mask 51unnecessary. A gas mixture of C₄F₈ (perfluorocyclobutane), O₂ (oxygen),CO (carbon monoxide), and Ar (argon) may be employed as thefluorine-based process gas that can ensure the selection ratio betweenthe inorganic film and the organic layer (the color filter 36 accordingto the present embodiment) in the dry etching.

The method of etching the first sealing layer 34 a and the secondsealing layer 34 c within the opening portion 45 is not limited toanisotropic etching such as the dry etching, and wet etching, which isisotropic etching, may be used. A solution including NH₄F (ammoniumfluoride) and HF (hydrogen fluoride) is enumerated as an etchingsolution. If such an etching solution is used, it is possible to ensurethe selection ratio between the inorganic film and the organic layer inthe etching. Then, proceeding to Step S4 takes place.

In the attaching of the substrates in FIG. 6 (Step S4), as illustratedin FIG. 8B, the transparent resin material having adhesive property isdispensed in such a manner as to cover the color filter 36. Then, theopposite substrate 41 is arranged at a given position with respect tothe base substrate 11 on which the transparent resin material, and forexample, the opposite substrate 41 is pressed toward the base substrate11. Thus, the element substrate 10 and the opposite substrate 41 areattached to each other with the transparent resin layer 42 made from thetransparent resin material in between. The transparent resin materialis, for example, thermal curing epoxy resin. The transparent resin layer42 is approximately 10 μm to 100 μm in thickness.

Thereafter, as illustrated in FIG. 2, the FPC 105 is built into theterminal portion 11 t of the element substrate 10, thereby completingthe organic EL device 100.

The method of manufacturing the organic EL device 100 is described abovewith one organic EL device 100 as a unit, but in reality, it isconsidered that multiple organic EL panels (in a state where the FPC 105has yet to be built) are formed at the same time in the organic ELdevice 100. An example is described below in which a mother substrate isused.

FIG. 10A is a schematic cross-sectional diagram illustrating the mothersubstrate to which the multiple element substrates are surface-attached.FIG. 10B is an enlarged schematic plan diagram illustrating the elementsubstrate in a surface-attached state. FIGS. 11A and 11B are schematiccross-sectional diagrams illustrating a construction of the terminalportion after the mother substrate is scribed.

Since the organic EL device 100 according to the present embodiment is atop emission type, as described above, a transparent quartz substrate oran opaque substrate such as a silicon substrate can be used as the basesubstrate 11, the element substrate 10. As illustrated in FIG. 10A, amother substrate 11W is, for example, the quartz substrate in the waferform and has orientation flat in which one part of the outer boundary iscut off. In the mother substrate 11W, the multiple element substrates 10are formed in a state where the multiple base substrates 11 aresurface-attached in the X direction and in the Y direction, with theorientation flat as a reference. In the attaching of the substrates(Step S4), in a state where the multiple organic EL elements 30, thesealing layer 34, and the color filter 36 are completed, the oppositesubstrate 41 is attached with respect to each of the element substrates10 by dispensing the transparent resin material. Thereafter, the mothersubstrate 11W is cut, along an imaginary scribe line SL between theelement substrates 10, into the discrete organic EL panels. Abrace-reinforced scribe method in which a cemented carbide tip or adiamond tip is used and a dicing method in which a diamond blade is usedare enumerated as a cutting method.

When the first sealing layer 34 a of and the second sealing layer 34 cof the sealing layer 34 and the color filter 36 are formed over theentire surface of the mother substrate 11W, there is a concern thatafter cutting the mother substrate 11W, a crack or peeling will occur inportions of the first sealing layer 34 a, the second sealing layer 34 c,and the color filter 36 (the coloration layers 36R, 36G, and 36B), whichare along the scribe line SL. In such a case, water or oxygen penetratesthrough the crack or the cleavage due to peeling into the functionallayer 32 and thus there is a likelihood that a dark spot will occur.

Then, in the forming of the color filter (Step S2), as illustrated inFIG. 10B, the opening portion 45 is formed in portions of the colorfilter 36 (the coloration layers 36R, 36G, and 36B) which overlap themultiple connection terminal 101, and at the same time a slit portion 46is formed by removing the portion that is along the scribe line SL. Inthe etching of the sealing layer (Step S3), the first sealing layer 34 aand the second sealing layer 34 c within the opening portion 45 andwithin the slit portion 46 are removed by the etching. If such a methodis used, because even though the mother substrate 11W is scribed (cut ordivided), as illustrated in FIG. 11A, the color filter 36 (thecoloration layer 36R, 36G, and 36B) is patterned in such a manner thatthe color filter 36 does not sit on an edge of the element substrate 10(the base substrate 11), that is, a cutting section, it is possible todecrease an occurrence of the crack or the peeling in the first sealinglayer 34 a and the second sealing layer 34 c and the color filter 36(the coloration layers 36R, 36G, and 36B).

Furthermore, the prevention of the crack and the peeling is not limitedto the method of patterning the color filter 36, described above, andfor example, the first sealing layer 34 a and the second sealing layer34 c may be etched by combining the slit portion 46 and the openingportion 45 and patterning the color filter 36 in such a manner that theopening portion 45 is included in the slit portion 46. When this isdone, as illustrated in FIG. 11B, in the terminal portion 11 t, endportions (equivalent to the inside wall of the opening portion 45 (theslit portion 46)) of the first sealing layer 34 a and the second sealinglayer 34 c and the color filter 36 may be kept away from the cuttingsection of the base substrate 11. In other words, if the connectionterminal 101 can be exposed, the color filter 36 as the organic layermay not be patterned in such a manner as to surround the connectionterminal 101.

In addition, a method of manufacturing the organic EL panel, in whichthe mother substrate is used, is not limited only to the side of theelement substrate 10. That is, the method of manufacturing the organicEL panel can be applied to a method in which the mother substrate 11W towhich the element substrate 10 is surface-attached and the mothersubstrate to which the opposite substrate 41 is surface-attached arecombined and then are cut.

According to the first embodiment described above, the following effectcan be obtained.

1. According to the organic EL device 100 and the method ofmanufacturing the organic EL device, the color filter 36 as the organiclayer on the sealing layer 34 according to the invention is formed insuch a manner as to cover the terminal portion 11 t, and furthermore,the opening portion 45 piercing the portions of the coloration layers36R, 36G, and 36E which overlap the multiple connection terminals 101.The dry etching is performed with the color filter 36 serving as themask, and the multiple connection terminals 101 within the openingportion 45 are exposed by removing the first sealing layer 34 a and thesecond sealing layer 34 c within the opening portion 45. Therefore, aspecial process is made unnecessary in which a dedicated resist patternis formed only for the purpose of exposing the multiple connectionterminals 101 and the dedicated resist pattern is moved after the dryetching. To put it another way, the organic EL device 100 with highproductivity and the method of manufacturing the organic EL device 100can be provided.

Furthermore, since the multiple connection terminals 101 within theopening portion 45 can be certainly exposed by dry-etching the portionsof the first sealing layer 34 a and the second sealing layer 34 c whichoverlap the multiple connection terminals 101, high reliability can berealized in the electrical connection between the multiple connectionterminals 101 and the FPC 105.

2. In the etching of the sealing layer (Step S3), since the metal mask51 as the protective member covering the display region E1 is used atthe time of the dry etching, the color filter 36 in the display regionE1 can be prevented from being damaged due to the dry etching.

3. When the organic EL panel making up the organic EL device 100 isformed using the mother substrate 11W, in the forming of the colorfilter (Step S2), not only the opening portion 45 that overlaps themultiple connection terminals 101, but also the slit portion 46 alongthe scribe line SL is formed. Therefore, since before cutting the mothersubstrate 11W, the portions of the first sealing layer 34 a and thesecond sealing layer 34 c, along the scribe line SL, are removed, it ispossible to reduce the occurrence of the crack or the peeling in thefirst sealing layer 34 a and the second sealing layer 34 c toward theside of the edge of the element substrate 10 in cutting the mothersubstrate 11W.

Second Embodiment

Method of Manufacturing the Organic EL Device

Next, a method of manufacturing an organic EL device 100 according to asecond embodiment is described, referring to FIGS. 12A and 12B. FIGS.12A and 12B are schematic cross-sectional diagrams illustrating themethod of manufacturing the organic EL device according to the secondembodiment. The method of manufacturing the organic EL device 100according to the second embodiment has basically the same processes asthe method of manufacturing the organic EL device 100 according to thefirst embodiment and is characterized by performing a sealing layeretching process after a substrate attachment process. For that reason,FIGS. 12A and 12B are cross-sectional diagrams equivalent to FIG. 5.

Specifically, as illustrated in FIG. 12A, an opposite substrate 41 isattached to an element substrate 10 on which a color filter 36 having anopening portion 45 is formed, with a transparent resin layer 42 inbetween. Then, as illustrated in FIG. 12B, multiple connection terminals101 are exposed by etching a first sealing layer 34 a and a secondsealing layer 34 c within the opening portion 45 with the color filter36 serving as a mask. Etching may be performed using a dry etchingmethod or a wet etching method.

In the method of manufacturing the organic EL device 100 according tothe second embodiment, a metal mask 51 as a protective member is notnecessary in the sealing layer etching process. Furthermore, even thoughthe dry etching or the wet etching is performed, multiple organic ELelements 30 and the color filter 36 can be protected more certainly,compared to a case where the opposite substrate 41 is not present.

Third Embodiment

Organic EL Device and Method of Manufacturing the Organic EL Device

Next, an organic EL device according to a third embodiment and a methodof manufacturing the organic EL device are described referring FIGS. 13to 15. FIG. 13 is a schematic cross-sectional diagram illustrating aconfiguration of a pixel of the organic EL device according to the thirdembodiment. FIG. 14 is a schematic cross-sectional diagram illustratingthe construction of the pixel of the organic EL device according to thethird embodiment, taken along a line XIV-XIV in FIG. 13. FIG. 15 is aschematic cross-sectional diagram illustrating a construction of theperiphery of a terminal portion of the organic EL device according tothe third embodiment. In addition, FIG. 15 is the schematiccross-sectional diagram equivalent to FIG. 5 according to the firstembodiment.

The organic EL device according to the third embodiment results fromdifferentiating a configuration of an organic layer formed on a sealinglayer 34 with respect to the organic EL device 100 according to thefirst embodiment. Therefore, the same configurations as those accordingto the first embodiment are given like reference numerals, and thedetailed descriptions thereof are omitted.

As illustrated in FIG. 13, in an organic EL device 200 according to thepresent embodiment, with regard to an arrangement of sub-pixels 18R,18G, and 18B, the sub-pixels 18R, 18G, and 18B in each of which emissionof color-different light can be obtained are arranged in this sequencein the X direction, and sub-pixels 18 in each of which emission of lightwith the same color can be obtained is arranged in the Y direction. Thethree sub-pixels 18R, 18G, and 18B arranged in the X direction arerepresented as one pixel 19.

A red (R) coloration layer 36R of a color filter 36 is formed in theform of a stripe in such a manner as to overlap pixel an electrode 31Rthat is arranged in the Y direction. A green (G) coloration layer 36G isformed in the form of a stripe in such a manner as to overlap pixel anelectrode 31G that is arranged in the Y direction. A blue (B) colorationlayer 36B is formed in the form of a stripe in such a manner as tooverlap a pixel electrode 31B that is arranged in the Y direction. Thecoloration layers 36R, 36G, and 36B are formed adjacent to one anotherin the X direction. In addition, the color filter 36 according to thepresent embodiment extends in the Y direction between thecolor-different coloration layers and includes an insulation layer 35 inthe form of a stripe which differentiates between the color-differentcoloration layers.

For details, as illustrated in FIG. 14, the insulation layer 35 isformed in the form of a stripe on the sealing layer 34 that covers themultiple organic EL elements 30. A cross-section of the insulation layer35 is in the form of a trapezoid. The bottom of the insulation layer 35,which comes into contact with the sealing layer 34, is greater than thetop portion. The insulation layer 35 is made from a photo-sensitiveresin material that does not contain a coloring material. To put itanother way, in a method of forming the insulation layer 35, aphoto-sensitive resin layer is formed by dispensing the photo-sensitiveresin material, which does not contain the coloring material, over anentire surface of a base substrate 11 using a spin-coating method, andthe insulation layer 35 is formed by exposing and developing thephoto-sensitive resin layer.

In forming the color filter, a photo-sensitive resin layer is formed bydispensing the photo-sensitive resin material containing the coloringmaterial over an entire surface of the base substrate 11 in such amanner as to cover the insulation layer 35 using the spin-coatingmethod, and each of the coloration layers 36R, 36G, and 36B is formedbetween the insulation layers 35. Therefore, a height of the insulation35 on the sealing layer 34 is smaller (lower) than a film thickness ofeach of the coloration layers 36R, 36G, and 36B.

When forming the coloration layers 36R, 36G, and 36B by dispensing thephoto-sensitive resin material containing the coloring material usingthe spin-coating method, in a case where the insulation layer 35 is notpresent, the photo-sensitive resin material is difficult to stay on adispense surface and a utilization ratio of the photo-sensitive resinmaterial is low. Consequently, the coloration layers 36R, 36G, and 36Bare difficult to form in a predetermined film thickness. In contrast,the insulation layers 35 in the form of a stripe are provided, and thecoloration layers 36R, 36G, and 36B are formed in such a manner thatspaces between the insulation layers 35 are filled with the colorationlayers 36R, 36G, and 36B. For this reason, the film thickness of each ofthe coloration layers 36R, 36G, and 36B is easy to increase. In otherwords, in the spin-coating method, the utilization ratio of thephoto-sensitive resin material can be improved.

The cross-sectional shape of the insulation layer 35 is not limited tothe trapezoid, but it is preferable that a length in the X direction ofthe bottom that comes into contact with the sealing layer 34 will be thesame as a dimension between the pixel electrodes 31, approximately 0.5μm to 1 μm. Furthermore, when the utilization ratio of thephoto-sensitive resin material described above is considered, it ispreferable that the height of the insulation layer 35 on the sealinglayer 34 be smaller than the film thicknesses of the coloration layers36R, 36G, and 36B and be equal to or more than half of the filmthickness. According to the present embodiment, the height of theinsulation layer 35 is defined as approximately 1 μm because the filmthicknesses of the coloration layers 36R, 36G, and 36B are formed withthe film thickness ranging from 1.5 μm to 2.0 μm.

If the insulation layer 35 is formed between the coloration layers ofcolor-different sub-pixel 18 in this manner, it is possible to reducecolor mixtures of or color balance changes in red light and green light,green light and blue light, and blue light and red light in terms ofview angle properties because a ratio is decreased at which lightemitted from the organic EL element 30 of the color-different sub-pixel18 passes through the coloration layer that is different in color lightfrom the coloration layer that the emitted light originally has to passthrough.

Furthermore, as illustrated in FIG. 15, the insulation layer 35 isformed in such a manner as to cover a terminal portion 11 t in a regionoutside of a display region E1. To put it another way, in the displayregion E1, the insulation layer 35 is formed in the form of a stripethat extends in the Y direction between the sub-pixels 18, but outsideof the display region E1, the insulation layer 35 is formed in such amanner as to cover an entire non-display region including the terminalportion 11 t. Then, in the exposure and the development of thephoto-sensitive resin layer that does not the coloring material, theinsulation layer 35 is patterned in such a manner as to have an openingportion 45 in a portion that overlaps a connection terminal 101.

In a sealing layer etching process, the connection terminal 101 isexposed by etching a first sealing layer 34 a and a second sealing layer34 c within the opening portion 45 with the insulation layer 35 servingas a mask. That is, according to the present embodiment, the insulationlayer 35, which is provided extendedly over the non-display regionoutside of the display region E1 and is formed in the form of a stripein the display region E1, is equivalent to the organic layer accordingto the invention.

According to the organic EL device 200 according to the third embodimentand the method of manufacturing the organic EL device 200, it ispossible to provide or manufacture the organic EL device 200 in whichthe color mixture or the color balance change is decreased in terms ofthe view angle properties, when compared to the organic EL device 100according to the first embodiment. In addition, it is difficult for theorganic EL device 200 according to the third embodiment to be influencedby variation in alignment in the exposure and the development of thephoto-sensitive resin layer because the opening portion 45 is formed inthe process of forming the transparent insulation layer 35, whencompared to a case where the opening portion 45 piercing through thecoloration layers 36R, 36G, and 36B for three colors are formedaccording to the first embodiment. That is, the opening portion 45 canbe formed that has high positional accuracy.

In addition, it is implied that according to the present embodiment, theinsulating layer 35 can be patterned in such a manner that theinsulation layer 35 does not sit on a cutting section of an elementsubstrate 10 (a base substrate 11) or in such a manner that a slitportion 46 and the opening portion 45 are integrated into one piece.

Fourth Embodiment

Organic EL Device and Method of Manufacturing the Organic EL Device

Next, an organic EL device according to a fourth embodiment and a methodof manufacturing the organic EL device are described referring FIGS. 16and 17. FIG. 16 is a schematic cross-sectional diagram illustrating aconstruction of a pixel of the organic EL device according to the fourthembodiment. FIG. 17 is a schematic cross-sectional diagram illustratinga construction of the periphery of a terminal portion of the organic ELdevice according to the fourth embodiment. FIG. 16 is the schematiccross-sectional diagram equivalent to FIG. 4 according to the firstembodiment. FIG. 17 is the schematic cross-sectional diagram equivalentto FIG. 5 according to the first embodiment. The organic EL deviceaccording to the fourth embodiment results from differentiating aconfiguration of an element substrate 10 with respect to the organic ELdevice 100 according to the first embodiment. Therefore, the sameconfigurations as those according to the first embodiment are given likereference numerals, and the detailed descriptions thereof are omitted.

As illustrated in FIG. 16, an organic EL device 300 has an elementsubstrate 10 and an opposite substrate 41 that is arranged in such amanner as to face toward the element substrate 10 with a transparentresin layer 42 in between. The element substrate 10 is configured toinclude a pixel circuit 20, an organic EL element 30, a sealing layer34, a color filter 36, and an overcoat layer 37, all of which are formedon a base substrate 11 in this sequence.

The overcoat layer 37 is formed for the purpose of alleviating surfaceirregularity of coloration layers 36R, 36G, and 36B formed on thesealing layer 34 and protecting the color filter 36. The overcoat layer37 is hereinafter referred to as the OC layer 37. The OC layer 37 isformed in such a manner as to cover the color filter 36, for example,using an acrylic-based or a polyimide-based photo-sensitive resinmaterial. The OC layer 37 is approximately 0.5 μm to 1 μm in thickness.

As illustrated in FIG. 17, the OC layer 37 is formed in such a manner asto cover a terminal portion 11 t. To put it another way, the OC layer 37is formed in such a manner as to cover a display region E1 and a dummyregion E2 and a non-display region including a terminal portion 11 t.Then, in exposure and development of a photo-sensitive resin layer madefrom the photo-sensitive resin material described above, the OC layer 37is patterned in such a manner that the OC layer 37 has an openingportion 45 in the portion that overlaps a connection terminal 101.

In a sealing layer etching process, the connection terminal 101 isexposed by etching a first sealing layer 34 a and a second sealing layer34 c within the opening portion 45 with the OC layer 37 serving as amask. That is, according to the present embodiment, the OC layer 37 isequivalent to an organic layer according to the invention.

In the organic EL device 300 according to the fourth embodiment and themethod of manufacturing the organic EL device, it is difficult for theorganic EL device 300 according to the fourth embodiment to beinfluenced by variation in alignment in the exposure and the developmentof the photo-sensitive resin layer because the opening portion 45 isformed in the process of forming the transparent OC layer 37, whencompared to a case where the opening portion 45 piercing through thecoloration layers 36R, 36G, and 36B for three colors are formedaccording to the first embodiment. That is, the opening portion 45 canbe formed that has high positional accuracy. In addition, even thoughthe sealing layer etching process is performed after forming the OClayer 37, the color filter 36 can be prevented from being damaged due todry etching without using a metal mask 51 as a protective member becausethe color filter 36 is covered with the OC layer 37.

Fifth Embodiment

Electronic Apparatus

Next, an electronic apparatus according to the present embodiment isdescribed referring to FIG. 18. FIG. 18 is a schematic diagramillustrating a head-mountable display as the electronic apparatus.

As illustrated in FIG. 18, a head-mountable display (HMD) 1000 as theelectronic apparatus according to the present embodiment has two displayunits 1001 provided to correspond to left and right eyes. A user M canview characters and images that are displayed on the display units 1001by wearing the head-mountable display 1000 on the forehead likeeye-glasses. For example, if parallactic images are displayed on theleft and right display units 1001, the user can enjoy viewingthree-dimensional images.

The display unit 1001 is equipped with the organic EL device 100according to the first embodiment (or the organic EL device 200according to the third embodiment, or the organic EL device 300according to the fourth embodiment). Therefore, the small-sized,lightweight head-mountable display 1000 can be provided that isefficient in cost performance resulting from high productivity.

The head-mountable display 1000 is not limited to being equipped withthe two display units 1001, but may be configured to include the onedisplay unit 1001 corresponding to any one of left and right eyeswithout any limitation to the two display units 1001.

In addition, the electronic apparatus, equipped with the organic ELdevice 100, the organic EL device 200, or the organic EL device 300, isnot limited to the head-mountable display 1000. As examples of this, theelectronic apparatuses equipped with the display unit are enumeratedsuch as a personal computer, a personal digital assistant, a navigator,a viewer, and a head up display.

The invention is not limited to the embodiments described above.Modifications thereto are possible within a scope not contrary to thegist or the technological idea of the invention, read from the aspectsand the entire specification, and an organic EL device and a method ofmanufacturing the organic EL device and an electronic apparatus to whichthe organic EL device is applied are also included in a technologicalscope of the invention. In addition to the embodiment described above,various modification examples are considered. The modification examplesare described below.

MODIFICATION EXAMPLE 1

The connection terminal 101 in the terminal portion 11 t on the elementsubstrate 10 is not limited to such a configuration. For example, theconnection terminal 101, like the pixel electrode 31, is not limited tobeing formed on the second interlayer insulation film 26, and the wiringlayer 103 on the first interlayer insulation film 24 may be defined asthe connection terminal. Therefore, in the sealing layer etchingprocess, the wiring layer 103 as the connection terminal may be exposedby etching the first sealing layer 34 a and the second sealing layer 34c within the opening portion 45 and the second interlayer insulationfilm 26 with each of the color filter 36 formed as the organic layer,the insulation layer 35, and the OC layer 37 serving as the mask.

Furthermore, for example, the arrangement of the contact hole 26 aelectrically connecting the connection terminal 101 and the wiring layer103 below the connection terminal 101 is not limited to being formedimmediately under the connection terminal 101 and may be formed in aposition that does not overlap the opening portion 45.

MODIFICATION EXAMPLE 2

According to each of the embodiments described above, the openingportion 45 is not limited to being formed in such a manner as to exposethe multiple connection terminals 101. FIG. 19 is a schematic plandiagram illustrating the arrangement of the opening portion and theconnection terminal according to the modification example. For example,as illustrated in FIG. 19, the opening portion 45 may be formed in sucha manner that the connection terminals 101 are exposed one by one. Ifthis is done, when the FPC 105 and the multiple connection terminals 101are electrically connected, for example, using the anisotropicconductive film, insulation between the connection terminals 101 can beincreased.

Furthermore, even though the opening portion 45 is not formed in such amanner as to expose all the multiple connection terminals 101, themultiple opening portions 45 may be formed in such a manner as to exposetwo or more connection terminals 101 as one unit among the multipleconnection terminals 101.

Besides, if the electrical connection between the connection terminal101 and the FPC 105 can be accomplished, the opening portion 45 may beformed in such a manner as to expose at least one part of the connectionterminal 101.

MODIFICATION EXAMPLE 3

According to the first embodiment described above, the opening portion45 is not limited to being formed in such a manner as to pierce throughthe deposited coloration layers 36R, 36G, and 36B for three colors. Forexample, the color filter 36 formed on the terminal portion 11 t mayresult from depositing only the coloration layer for one color or thecoloration layers for two colors. The number of deposited colorationlayers may be determined by taking into consideration the selectionratio between the inorganic film and the organic layer, that is, thecoloration layer in terms of the fluorine-based process gas used in thedry etching. If the number of deposited layers is insufficient with thecoloration layers 36R, 36G, and 36B for three colors, a combination ofthe insulation layer 35 and the OC layer 37 may be possible.

MODIFICATION EXAMPLE 4

The connection terminal 101 that is exposed within the opening portion45 is not limited to accomplishing the electrical connection between theconnection terminal 101 and the FPC 105. For example, the invention canbe applied also to the connection terminal for inspection that isprovided to inspect a drive state or electric characteristics of eachpixel circuit 20 through the inspection circuit 17 provided in theelement substrate 10.

Furthermore, for example, if an alignment mark, used in determining aposition of an output terminal of the FPC 105 and the connectionterminal 101 of the element substrate 10, is provided in the terminalportion 11 t on the element substrate 10, when the alignment mark iscovered with the inorganic film or the organic layer (the colorationlayer) that is not transparent, the mark alignment is difficult toidentify in a positioning method in which a position is determined withimage recognition for which an imaging element such as a charge-coupleddevice (CCD) is used. Accordingly, the opening portion for exposing thealignment mark may be formed in the organic layer (the colorationlayer). In other words, it is preferable that the organic layer bepatterned in such a manner as not to cover the alignment mark.

MODIFICATION EXAMPLE 5

The configuration of the sealing layer covering the terminal portion 11t is not limited to the first sealing layer 34 a and the second sealinglayer 34 c. A configuration may be possible in which the terminalportion 11 t is covered with the sealing layer 34 including the bufferlayer 34 b. Therefore, the first sealing layer 34 a and the buffer layer34 b, and the second sealing layer 34 c within the opening portion 45are removed by the etching. The extension of the etching time isconsidered when compared to the case where the first sealing layer 34 aand the second sealing layer 34 c are etched, but the selection ratiocan be ensured at the time of the etching. For example, the organiclayer as the mask (the coloration layer of the color filter 36, theinsulation layer 35, and the OC layer 37) may be selected or a type offluorine-based process gas, used in the etching, or a type offluorine-based solution may be selected.

MODIFICATION EXAMPLE 6

In the organic EL device 200 according to the third embodiment describedabove, the insulation layer 35 that is formed between thecolor-different coloration layers is not limited to extending in the Ydirection within the display region E1 and being formed in the form of astripe. FIGS. 20A to 20C are schematic diagrams illustrating theinsulation layer according to the modification example. FIG. 20A is aschematic plan diagram. FIG. 20B is a schematic cross-sectional diagramtaken along a line XXB-XXB in FIG. 20A. FIG. 20C is a schematiccross-sectional diagram taken along a line XXC-XXC in FIG. 20A. Forexample, as illustrated in FIGS. 20A and 20B, the insulation layer 35may be formed such that insulation layer 35 extends along the long sideand the short side of the pixel electrode 31 of the sub-pixel 18 in theX direction and in the Y direction in such a manner as to surround theopening portion 28 a. That is, in the display region E1, the insulationlayer 35 may be formed in the form of a lattice in such a manner thatthe sub-pixels 18R, 18G, and 18B results from the partitioning. Asillustrated in FIG. 20C, a film covers the insulation layer 35 that isprovided between the sub-pixels 18B representing the same color and thecoloration layers 36B is formed by processing the film. The top portion35 a of the insulation layer 35 is also covered with the colorationlayer 36B. The same is true for the other coloration layers 36R and 36G.

Since each of the coloration layers 36R, 36G, and 36B is formed bydispensing the photo-sensitive resin material including the coloringmaterial using the spin-coating method, the insulation layer 35according to the present modification example is provided in the form ofa lattice. Thus, the coloration layers 36R, 36G, and 36B are formed insuch a manner that spaces between the insulation layers 35 are filledwith the coloration layers 36R, 36G, and 36B. For this reason, the filmthickness of each of the coloration layers 36R, 36G, and 36B is easy toincrease. In other words, in the spin-coating method, the utilizationratio of the photo-sensitive resin material can be more improved.

MODIFICATION EXAMPLE 7

In the organic EL devices 100, 200, and 300 according to the embodimentsdescribed above, light-emitting pixels provided on the display region E1are not limited to the sub-pixels 18R, 18G, and 18B that correspond toemission of red (R), green (G), and blue (B) light, respectively. Forexample, in order to obtain a different color in addition to the threecolors, a sub-pixel 18Y may be included in which emission of yellow (Y)light can be obtained. Accordingly, it is possible to further increasecolor reproductivity.

The present application claims priority to Japanese Patent ApplicationNo. 2012-237563 filed in the Japanese Patent Office on Oct. 29, 2012,the entire contents of which are incorporated herein by reference.

What is claimed is:
 1. A method of manufacturing an organic EL deviceincluding a plurality of organic EL elements that are arranged on asubstrate, the plurality of organic EL element including an organiclight-emitting layer interposed between an anode and a cathode, and aconnection terminal disposed on the substrate, the method comprising:forming a sealing layer by covering the plurality of organic EL elementsand the connection terminal such that the plurality of organic ELelements lie between the substrate and the sealing layer; forming anorganic layer that is formed above the sealing layer; patterning theorganic layer in such a manner that an opening extending up to thesealing layer is formed in a portion of the organic layer, whichoverlaps the connection terminal; and etching the sealing layer in sucha manner as to expose at least one part of the connection terminal withthe pattern-formed organic layer serving as a mask.
 2. The method ofmanufacturing an organic EL device according to claim 1, wherein theorganic EL device includes a color filter including coloration layersrepresenting at least red, green, and blue above the sealing layer, andwherein the organic layer is formed as at least the coloration layerrepresenting at least one color.
 3. The method of manufacturing anorganic EL device according to claim 1, wherein the organic EL deviceincludes a color filter including coloration layers representing atleast red, green, and blue above the sealing layer, and wherein theorganic layer is formed, as an insulation layer that differentiatesbetween the coloration layers in terms of color, above the sealinglayer.
 4. The method of manufacturing an organic EL device according toclaim 1, wherein the organic EL device includes, sub-pixels whichincludes one of the plurality of organic EL elements, and which areprovided corresponding to at least red, green, and blue, a pixelincluding the color-different sub-pixels, and a color filter includingcoloration layers representing at least red, green, and blue on thesealing layer, and wherein the organic layer is formed, as an insulationlayer that differentiates between the coloration layers in terms ofcolor and differentiates between the sub-pixels, above the sealinglayer.
 5. The method of manufacturing an organic EL device according toclaim 2, wherein in the etching of the sealing layer, the sealing layeris anisotropically etched in a state where a protective member isarranged in such a manner as to face toward the color filter.
 6. Themethod of manufacturing an organic EL device according to claim 2,further comprising: arranging an opposite substrate with respect to thecolor filter with a transparent resin layer in between, wherein in theetching of the sealing layer, the sealing layer is etched with theopposite substrate in between.
 7. The method of manufacturing an organicEL device according to claim 1, wherein the organic EL device includes acolor filter including coloration layers representing at least red,green, and blue above the sealing layer, and wherein the organic layeris an overcoat layer that is formed above the color filter.
 8. Themethod of manufacturing an organic EL device according to claim 1,wherein in the patterning of the organic layer, the opening portion isformed in such a manner as to be opened over a plurality of theconnection terminals.
 9. An electronic apparatus comprising: the organicEL device formed using the method of manufacturing an organic EL deviceaccording to claim
 1. 10. An electronic apparatus comprising: theorganic EL device formed using the method of manufacturing an organic ELdevice according to claim
 2. 11. An electronic apparatus comprising: theorganic EL device formed using the method of manufacturing an organic ELdevice according to claim
 3. 12. An electronic apparatus comprising: theorganic EL device formed using the method of manufacturing an organic ELdevice according to claim
 4. 13. An electronic apparatus comprising: theorganic EL device formed using the method of manufacturing an organic ELdevice according to claim 5.